Issues & Practices

Issues

Anti-counterfeiting

California Proposition 65

China Tariffs

Conflict Minerals

Cybersecurity

Legislative Updates

REACH

 

GIPC Guidelines and Best Practices

The following resources were developed by ECIA's Global Industry Practices Committee (GIPC). You can learn more about the work of the GIPC here.

Business Process Operations

China Tariff Resources
Congress Passes Online Marketplace Legislation
Legislation on Online Buying of COTS Items Advances in Congress

Guidelines for EDI Transactions

EDI Transaction Set 810: Invoice (Inbound)
EDI Transaction Set 830: Planning Schedule with Release Capability (Forecast)
EDI Transaction Set 832: Price Sales Catalog
EDI Transaction Set 844: Product Transfer Account Adjustment (Ship and Debit) – Outbound to Supplier
EDI Transaction Set 849: Product Transfer Account Adjustment (Ship and Debit) – Inbound from Supplier
EDI Transaction Set 845: Price Authorization Acknowledgement Status
EDI Transaction Set 850: Purchase Order
EDI Transaction Set 855: Purchase Order Acknowledgement
EDI Transaction Set 856: Ship Notice/Manifest
EDI Transaction Set 860: Purchase Order Change Request – Buyer Initiated
EDI Transaction Set 865: Purchase Order Change Acknowledgement – Seller Initiated

EDI Transaction Set 867: Product Transfer and Resale Report

ECIA Design Registration Best Practices
ECIA Design Registration Form
Recommended Technical Standards for Point-of-Sale Reports
ECIA Statement on the Reliability Impact of Procuring Devices through Non-Authorized Sources
NIGP 110: Technical Guidelines for Electronic Price/Sales Catalog
NIGP 116: ECIA Guidelines for Disposition of Excess Inventory

 

Environmental Compliance

California Proposition 65
Conflict Minerals
Company Information
Regulatory and Legal Updates
ECIA Position Paper: Use of the EICC GeSI Template for Reporting Conflict Minerals Information
REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals)

 

International Trade Compliance

ECIA Position Paper: Transmittal of Trade Compliance Data

 

IT Security/Testing

Cyber Security

 

Logistics Services

NIGP 101.01: Guidelines for Commercial Semiconductor Packaging and Labeling
NOTE: Superseded by JEP 130
NIGP 102: Guidelines for Unit Packing for Integrated Circuits – Tubes (Rails)
NOTE: Superseded By JEP 130
NIGP 103: Guidelines for Identification and Labeling of Moisture Sensitive Integrated Circuits
NOTE: Superseded by JEP 113-XX
NIGP 104: Guidelines for the Packing and Handling of Moisture Sensitive Integrated Circuits
NOTE: Superseded by IPC/JEDEC J-STD-033B.1
NIGP 105: Handling Guidelines for Moisture Sensitive Plastic Surface Mount Components
NOTE: Superseded by IPC/JEDEC J-STD-033B.1
NIGP 106b: Handling Guidelines for the Transference of Tray-Packaged ICs
NIGP 108: Guidelines for Packing & Dunnage of Electronic Components
NIGP 111: Guidelines for the Format of Packing Slips
NIGP 112: NEDA Guidelines for Auto Identification (1-Dimensional Bar Code & 2-Dimensional Matrix &
Code for Suppliers Product Package Shipment Labeling)
NOTE: CANCELLED Included in EIGP 114
NIGP 113: NEDA Guidelines for Product Returns
EIGP 114.2018: ECIA Labeling Specification for Product and Shipment Identification in the Electronics
Industry - 2D Barcode (Including Human Readable and 1D Barcode)

NIGP 117: ECIA Guideline for Date Code Marking Format

 

Quality

ECIA White Paper: Comparing DFARS Section 252.246-7007 and AS6496 Counterfeit Avoidance Policy
ECIA Position Paper: Product Change Notification
Managing Date Code Restrictions on Orders for Electronic Components
NIGP 107: Guidelines for the Format of Military Certificates of Conformance
NIGP 109: Guidelines for Distributor Assessment of Manufacturer Performance
NIGP 115: Certificates of Conformance for Commercial Electronic Parts