Issues & Practices
GIPC Guidelines and Best Practices 
The following resources were developed by ECIA's Global Industry Practices Committee (GIPC). You can learn more about the work of the GIPC here.
Business Process Operations
Automated Data Exchange (ETL) Business Reviews Best Practices China Tariff Resources Congress Passes Online Marketplace Legislation Coronavirus Resources TPC Electronic Industry Coronavirus Impact Survey Legislation on Online Buying of COTS Items Advances in Congress Model Distribution Training
Guidelines for EDI Transactions
EDI Transaction Set 867: Product Transfer and Resale Report
ECIA Design Registration Best Practices ECIA Design Registration Form Recommended Technical Standards for Point-of-Sale Reports ECIA Statement on the Reliability Impact of Procuring Devices through Non-Authorized Sources NIGP 110: Technical Guidelines for Electronic Price/Sales Catalog NIGP 116: ECIA Guidelines for Disposition of Excess Inventory
Environmental Compliance
California Proposition 65 Conflict Minerals Company Information PIP (3:1) Regulatory and Legal Updates ECIA Position Paper: Use of the EICC GeSI Template for Reporting Conflict Minerals Information REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals)
International Trade Compliance
ECIA Position Paper: Transmittal of Trade Compliance Data
IT Security/Testing
Cybersecurity Cybersecurity Ransomware Readiness Cybersecurity Risk Management Communicating Risks Cybersecurity Work Group Executive Summary
Logistics Services
NIGP 101.01: Guidelines for Commercial Semiconductor Packaging and Labeling NOTE: Superseded by JEP 130
NIGP 102: Guidelines for Unit Packing for Integrated Circuits – Tubes (Rails) NOTE: Superseded By JEP 130
NIGP 103: Guidelines for Identification and Labeling of Moisture Sensitive Integrated Circuits NOTE: Superseded by JEP 113-XX
NIGP 106b: Handling Guidelines for the Transference of Tray-Packaged ICs
NIGP 108: Guidelines for Packing & Dunnage of Electronic Components
NIGP 111: Guidelines for the Format of Packing Slips
NIGP 112: NEDA Guidelines for Auto Identification (1-Dimensional Bar Code & 2-Dimensional Matrix &
Code for Suppliers Product Package Shipment Labeling) NOTE: CANCELLED Included in EIGP 114
NIGP 113: NEDA Guidelines for Product Returns
EIGP 114.2018: ECIA Labeling Specification for Product and Shipment Identification in the Electronics
Industry - 2D Barcode (Including Human Readable and 1D Barcode)
NIGP 117: ECIA Guideline for Date Code Marking Format
Quality
ECIA White Paper: Comparing DFARS Section 252.246-7007 and AS6496 Counterfeit Avoidance Policy ECIA Position Paper: Product Change Notification Managing Date Code Restrictions on Orders for Electronic Components
NIGP 107: Guidelines for the Format of Military Certificates of Conformance NIGP 109: Guidelines for Distributor Assessment of Manufacturer Performance NIGP 115: Certificates of Conformance for Commercial Electronic Parts
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