Connecting innovation to application for next gen design.
QRTS 2015 – March 23rd - 25th
|Today’s “critical use” applications require the most advanced components, materials and manufacturing and test methodologies available. Bringing customers and factory technical experts together in one place, QRTS offers customers the unique opportunity to not only learn about the latest achievements for “critical use” applications, but a variety of venues in which to share their specific needs with factory experts. At the same time, component manufacturers have a chance to receive real-time feedback critical for improvement of their current products as well as insight into future product demand directly from their customers.The following program is subject to change.|
Monday, March 23
|1:00 pm||Seminar: Dr. Diganta Das, CALCE, Counterfeit Electronic Components: Detection and Avoidance
The seminar will draw upon the practical experience of Dr. Das on the area of counterfeit parts through his work with government, industry, academia, law enforcement, test laboratories, electronic part users, distributors and manufacturers.Dr. Diganta Das, Center for Advanced Life Cycle Engineering (CALCE), Univ. of MD will deliver the latest research on detection and avoidance of counterfeit electronic components.
|2:30 pm||Industry Panel: Counterfeit Electronic Components: Current Processes, Policies & Testing Panel: A panel of industry experts will discuss their perspective on current processes, policies and testing activity around Counterfeit Components. Robin Gray, ECIA’s Chief Operating Officer and General Counsel, will moderate. Robin is a sought-after expert in this area and serves on a number of government and industry committees that oversee regulations affecting our industry. The panel is comprised of: Jim Connell, FAE Tantalum and MLCC Capacitors, Vishay Intertechnology; Gary Pugsley, Global Security Manager and Corporate Facility Security Officer for ON Semiconductor; Kevin Sink, Vice President of Total Quality for TTI, Inc.; and Laurence Sweeney, Senior Sales Executive for NKK Switches.|
|5:30 - 6-30 pm||Reception|
Tuesday, March 24
|7:30—8:15 am||Continental Breakfast|
|8:30 am||Keynote: Dale Ford, IHS Technology Electronic Components: End Market Opportunities|
|9:30 am||Military/Aerospace Presentation
The Importance of ‘Getting it Right the First Time;' Michael Cozzolino, Raytheon Aerospace and Space Systems
In most applications, getting it right the first time is the goal for technology. However, in many military and space applications, this mantra can mean life, death or no second chances. Therefore, Raytheon’s approach is proven and reliable technology along with cautious innovation. This goal is paramount, but there is always pressure for reduced size and weight while maintaining performance and reliability. This has meant integrating newer technologies with older, proven capabilities which may include the latest designs while using leaded or surface mount technologies. Weight and size considerations such as embedded or integrated technologies are constantly measured against the risk/reward paradigm.
|1.1||AFRL Capacitor Test Measurements in Replicated Aircraft Environment; Logan Raymond, UES Inc.|
|1.2||Advances & Performance in Polymer Hermetic Seal (PHS) Ta Capacitors; Yuri Freeman, KEMET Electronics|
|1.3||Counterfeit Component Detection at Raytheon: Techniques, Examples and Statistical Results; Michael Cozzolino, Raytheon Aerospace and Space Systems|
|1.4||Lower PM Content Metallization for Passive Component for Reliable Applications; Doug Hargrove, Heraeus|
|New Product Introductions
Surface Mount Hermetic Conversion – Vishay Intertechnology
New Robust Wet Tantalum with High Capacitance Offerings – Vishay Intertechnology
|2:00 pm||Automotive Applications Presentation
The Electronic Evolution in Automotive Applications; Dwight Howard, Delphi Electronics & Safety
The content and use of electronics in automotive applications continues to increase dramatically including expanded uses in continuous connectivity, performance, and accident avoidance. This session will address the emerging trends and applications for electronic components from one of the industry’s major OEMs. Attendees will gain insight into Delphi’s various divisions, their global footprint (engineering/product development, manufacturing), customers and market regions, products and technologies throughout the world.
|2.1||High Performance Axial Capacitors for Automotive Electronics; Rong Xu, KEMET Electronics AB|
|2.2||Complexities in the Thermal Modeling of Chip Resistors; Amit Das, State of the Art, Inc.|
|2.3||Random Vibration Testing of Advanced Wet Tantalum Capacitors; Alexander Terverosky, ASRC|
|2.4||Reliability of Tantalum Capacitors with Conductive Polymer and Manganese Dioxide Electrolytes under Thermal Cycling; Anto Peter, CALCE, University of Maryland|
|New Product Introductions
Surface Mount Molded Tantalum – Vishay Intertechnology
Tantalum Polymer – Vishay Intertechnology
|6:00—7:00 pm||Networking Reception|
Wednesday, March 25
|8:30 am||Medical Applications Presentation
Recent trends in the Selection of Electrical Components for Implantable Medical Technology; Dr. Joachim Hossick Schott (Medtronic Energy and Components Center), Mark Gresko (Medtronic Tempe Campus)
What are the general trends in health care and in the implantable device markets, and how do these trends impact electrical component selections? Among the issues presented are "Make vs Buy" decisions, general use conditions in implantable devices, and general reliability requirements for implantable medical components with components such as capacitors serving as examples. Attendees will gain a better understanding of the electrical components market for implantable medical devices.
|3.1||HAST Testing of Aluminum Electrolytic Capacitors with Conductive Polymer Electrolytes; Helmut Bevensee, CALCE, University of Maryland|
|3.2||How to Design with a Programmable Switch; Hassan Sajadi, NKK Switches|
|3.3||Failure Analysis of Hi-CV miniature MLCC by Dual Beam FIB; Kiyoshi Matsubara, KYOCERA Corporation|
|3.4||Authorized Enhanced Testing vs. Independent Up-Screening – Quality of Test; Gary Francoeur, Rochester Electronics|
|New Product Introductions|
|1:00 pm||Energy Applications Presentation
The New Era for Energy Exploration; Scott Kennedy, Logix Sales & Marketing, Inc.
|4.1||Hermetically Sealed Low ESR, High Reliability Ta Capacitors; Chris Reynolds, AVX Corporation|
|4.2||Resistor Selection for Pulse/Surge Applications; Tom Morris, TT electronics|
|4.3||Reliability Factors and Failure Mechanism of a Deep Trench Silicon Capacitor; Catherine Brunel, IPDiA|
|4.4||Tailoring the Microstructure: Optimization of Tantalum Powders for Highest Voltage Applications up to 350 V; Marcel Hagymasi, H.C. Starck GmbH|
|New Product Introductions|