ESC Committees and TAGs

EIA Standards Council (ESC) Committees

S-1 Steering Committee
Committee Scope: The S-1 Passive Component Steering Committee's scope is to provide leadership and direction for passive component standards engineering working groups. The Committee will offer an opportunity for creating a unifying environment for interaction between all passive component users and producers.
Committee Chairman: Mike Lauri, IBM Corp.

Electronic Connectors and Sockets

CE-2.0 National Connector and Socket Standards Committee
Committee Scope: The committee is populated by experienced individuals, including a number of those responsible for labs themselves, including manufacturers of MIL connectors. The CE-2.0 committee is responsible for developing standards for electronic connectors and sockets and associated hardware. It is most well-known for the EIA 364-series of test procedures, which are used globally and adopted by the US DoD. The committee typically meets face-to-face several times annually and conducts business between meetings through the ECIA electronic workspace. 364 Series Library Committee Access Link
Committee Chairman: Frank Ruffino, Molex Incorporated


P-2.1 Ceramic Dielectric Capacitors
Committee Scope: All types of Ceramic Dielectric Capacitors
Committee Chairman: Michael Cannon, TDK Corporation of America

P-2.2 Paper, Film, Mica & Wet-Electrolytic Capacitors
Committee Scope: Paper, film, mica and wet-electrolytic capacitors for all AC and DC applications, except inductive heating and utility power-factor correction.
Committee Chairman: Open

P-2.5 Solid Electrolytic Capacitors
Committee Scope: All types of Tantalum Capacitors
Committee Chairman: Keith Moore, KEMET Electronics


P-1 Resistive Devices
Committee Scope: All types of resistive components regardless of technology. Includes composition, film, wirewound, thermistors, varistors, networks, chip resistors and integrated passive devices.
Committee Chairman: Joseph Biernacki, Stackpole Electronics


P-3 Inductive Components
Committee Scope: The Committee approved (7 Oct. 1998) a change in the scope of the P-3, Inductive Components Committee. "This committee covers all types of inductive components regardless of technology used in electronic circuits. It includes inductors, rf. (chokes, filters, interference filters, inductors and transformers), chip inductors, and variable inductors."
Committee Chairman: Joseph Biernacki, Stackpole Electronics

Other Committees

ACH Automated Component Handling

Committee Scope: Develop and maintain engineering standards and publications for tape, reels, magazines, trays, etc. for handling components in production. Also, provide technical input to US national positions on related international standards issues and proposals.
Committee Chairman: Brian Matheny, TEKPAK Inc.

Microwave Vacuum Electron Devices
Committee Scope: Develop and maintain engineering standards and specification for the microwave vacuum power tube industry.
Committee Chairman: Joseph Celia, Union City Filament Corporation

Soldering Technology
Committee Scope: The STC encompasses soldering practices (soldering iron-mass reflow techniques) and associated soldering materials (solders, pastes and adhesives, and flux/cleaning agents). However, the Committee will focus on solderability test method development for printed through-hole (PTH) and surface mountable components. One of the major functions is to promote commonality and standardization of soldering test methodology within the EIA Sectors.
Committee Chairman: Doug Romm, Texas Instruments Inc.


EIA Standards Council (ESC) TAGs

Switches for Appliances SC23J
TAG Scope: To prepare standards related to switches (mechanical, electromechanical or electronic) for appliances actuated by hand, by foot or by other human activity, to operate or control electrical appliances and other equipment for household or similar purposes with a rated voltage not exceeding 440 V and a rated current not exceeding 63 A. It covers also switches intended to be incorporated in or with appliance equipment. It covers also the general requirements and test methods for electromechanical switches with optional quality assurance procedures.
US Technical Advisor: Kirk Anderson, UL

Miniature Fuses SC32C
TAG Scope: To prepare International standards regarding specifications of miniature fuses and thermal-links, which are mainly used for the protection of circuits in electronic equipment.
US Technical Advisor: Mr. William Travis, Littelfuse Incorporated

Capacitors and Resistors TC40
TAG Scope: To prepare international standards for:

  1. Capacitors and resistors intended for use in equipment for telecommunication and electronic devices employing similar techniques.
  2. Capacitors, resistors and inductors for radio interference suppression and complete radio interference suppression filter units (see note).
  3. Passive integrated circuits or networks containing resistors or capacitors or their combinations. For the dimensional standardization of the final package, requirements laid down by TC 47 shall be adopted whenever possible.

Note : In this work, use is to be made as far as possible of any relevant work of TC 51 on inductors, and of the CISPR on the measurement of radio interference suppression characteristics. Liaison is also to be maintained with TC 61 and other appropriate IEC Technical Committee on the safety aspects of Radio interference suppression components and filter units.

US Technical Advisor: Kurt Zipp, Consultant

Packaging of Components for Automated Handling TC40 WG36
TAG Scope: To prepare a specification for the packaging on continuous tape of electronic components with unilateral or radial terminations.
US Technical Advisor: Kurt Zipp, Consultant

Electromechanical Components & Mechanical Structures TC48
TAG Scope: Standardization of electric connectors, connecting devices and mechanical structures for electronic and electrical equipment.
Note 1: RF connectors will not be dealt with by the technical committee as they will be covered by TC 46 together with RF cables. However, hybrid connectors, which employ RF contacts, will be handled by TC 48. They will use the appropriate test methods, terminology etc. defined by TC 46 and TC 86 documents.
Note 2: Sockets for components shall be considered in co-operation with the relevant technical committee.
Note 3: Safety requirements for areas already dealt with by other committees will not be developed by this technical committee.
US Technical Advisor: Vincent C. Pascucci, TE Connectivity

Connectors SC48B
TAG Scope: To prepare standards for electrical connectors and connecting devices. Standards for electrical connector test methods and for solderless connection technologies are also prepared.
Note 1: RF and fibre optic connectors will not be dealt with by the sub-committee; hybrid connectors which additionally employ RF and/or fibre optic contacts, will be handled in cooperation with TC 46 and/or TC 86.
Note 2: IEC 61984: Connectors - Safety requirements and tests is covered by this sub-committee. Safety requirements for areas already dealt with by other committees will not be developed by this sub- committee.
US Technical Advisor: Vincent C. Pascucci, TE Connectivity

Mechanical Structures SC48D
TAG Scope: To prepare IEC standards for mechanical structures for electrical and electronic equipment on the two main fields; the first one is related to the standardization of indoor mechanical structures for electronic equipment. The second activity deals with the standardization of outdoor mechanical structures. Both activities deal with their environmental (test) criteria and their thermal management. ”
US Technical Advisor: Richard Schlack, Southco Inc.

Piezoelectric & Dielectric Devices TC49
TAG Scope: To prepare international standards for piezoelectric, dielectric and electrostatic devices for frequency control, selection and detection, such as resonators, filters, oscillators, sensors and their related products (excluding those piezoelectric transducers dealt with by TC 29 and TC 87 and active devices dealt with by SC 47F) and for the associated materials.
US Technical Advisor: Claudia Kajiyama, Consultant

Magnetic Components & Ferrite Devices TC51
TAG Scope: To prepare standards relating to:

  1. Parts and components displaying magnetic properties and intended for electronics in a wide range of application areas, including telecommunications, computers, automotive, audio, video, lighting, solar and wind power systems, welding, inductive heating, power conditioning (UPS) and RFID;
  2. Parts associated with such components;
  3. Measuring methods and tests, and specifications for transformers and inductors using such components;
  4. Ferrite materials

US Technical Advisor: Matthew Wilkowski, Altera Corporation

Dependability TC56
TAG Scope: To prepare international standards in the field of dependability. Dependability covers the availability performance and its influencing factors: reliability performance, maintainability performance and maintenance support performance (including management of obsolescence). The standards provide systematic methods and tools for the dependability assessment and management of equipment, services and systems throughout their life cycles.

US Technical Advisor: Milena Krasich, Raytheon IDS

All-or-nothing Electrical Relays TC94
TAG Scope: To prepare international standards applicable to all-or-nothing electrical relays used in the various fields of Electrical Engineering covered by the IEC, normally produced in very large numbers as components of electromechanical or electronic equipment and eventually submitted to Quality Assurance requirements based on sampling techniques.
US Technical Advisor: John Kovacik, UL

Environmental Tests TC104
TAG Scope:

  1. Standardization of environmental condition classes which represent the conditions to which products are most likely to be subjected whilst being:
    (a) transported, (b) stored, (c) installed, and (d) used.The classification shall use validated environmental parameters and provide guidance in the selection and use of those classes intended for the preparation of relevant specifications.
  2. Standardization of environmental test methods intended for the preparation of relevant specifications and to provide guidance in the selection and use of those methods.
  3. The correlation and transformation of environmental condition classes to environmental tests.
  4. Provision of the Horizontal Safety Function for:
    1. methods for climatic tests
    2. methods for testing mechanical robustness.
    3. 5. Excluded from the scope of this committee are those matters which are within the scope of other IEC Committees, such as Electromagnetic Compatibility (TC 77 and CISPR), Safety (TC 62, TC 66 and TC 74), Fire Hazard (TC 89), Ionizing Radiation (TC 45), Explosive Atmospheres (TC 31) and Dependability (TC 56). Internal liaisons are maintained with those IEC committees which are specifically excluded from the scope.

US Technical Advisor: Peter J. Chiaro, Jr. Department of Homeland Security DNDO

Electronic Display Devices TC110
TAG Scope: Standardization, in the field of electronic display devices and specific relevant components, of terms and definitions, letter symbols, essential ratings and characteristics, measuring methods, specifications for quality assurance and related test methods, and reliability.

US Technical Advisor: Diane H. Williams, Corning Incorporated

Printed Electronics TC119
TAG Scope: Standardization of terminology, materials, processes, equipment, products and health/safety/environment in the field of printed electronics
US Technical Advisor: Dr. Dan Gamota, Jabil